SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), a global leader in the design and manufacture of semiconductor, LED and ...
Choosing the right Surface Finish for Chip on Board assembly is crucial. One of the most frequent questions we are asked at KingCredie Technologies is how should my PCB be plated in order to ensure ...
While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's National Cheng ...
At SEMICON India ’25, TANAKA PRECIOUS METALS leaders Yutaka Ito, Natalie Abe, and Satoshi Teshima share how ultra-pure bonding wires and sustainable recycling are redefining semiconductor materials — ...
Used for connecting wires from chip to packing using aluminum or gold wire. Open on a case-by-case basis to the university users outside of the home department Open on a case-by-case basis to academic ...
As the shift to electric vehicles (EVs) accelerates around the world, one Japanese company is attracting attention as a major supplier of components used in batteries and other indispensable ...
Alongside its S6053BO-V and S6056BO inline inspectionssystems, Viscom now offers a desktop version for automatic optical wire bondinspection. The compact S2088BO-II is intended for the inspection of ...
Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...
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