MUNICH--(BUSINESS WIRE)--onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, today announced a series of new MOSFET devices that feature innovative top-side cooling to assist ...
Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology ...
The Dual Cool™ package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package resulting in more than 60 ...
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The Packaging People Insights: The Role of Packaging Design in Building Long-Term Brand Recognition
As brands compete across physical shelves, direct-to-consumer platforms, and third-party marketplaces, packaging often becomes the most ...
Amcor Rigid Packaging’s annual reveal highlights how consumer insights drive new concepts in package design. “The Bottles of the Year program celebrates the best in packaging design,” said Terry ...
At APEC 2025, Nexperia announced several important additions to its portfolio of enhancement-mode GaN and SiC devices. Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced ...
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