Kenji Hata (Prime Senior Researcher), the Nanotube Research Center (NTRC; Director: Sumio Iijima) of the National Institute of Advanced Industrial Science and Technology (AIST; President: Ryoji ...

Through-silicon-via (TSV) is a promising three-dimensional (3D) packaging technology due to its advantages of high performance, reduction in packaging volume, low power consumption, and ...

Lithium metal shows great promise as an anode material for next-generation high-energy-density batteries. However, the issues of dendrite growth and huge volume fluctuations that occur with lithium ...

While researching copper plating graphite for a project, [Dave] stumbled upon a blog post illustrating a brilliant approach to metal plating 3D printed parts. Our pioneers in this new technique are ...

This work explores the deposition of nanoscale copper utilizing five different electroless bath formulations based on xylitol. Good complexation, reduction, and pH control were demonstrated in the ...

Electroplating is a technique that uses an electrical current to deposit a thin layer of metal onto a surface. It is widely used across industries to enhance material properties, such as durability, ...