IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...
Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
Irvine, CA. TopLine, a designer and manufacturer of semiconductor packages and PCB assemblies, has started a new service that makes it easy for universities, research facilities, laboratories, and ...
-Aiming for mass production in FY2026 for real-world implementation in the fields of 6G communications and non-destructive sensing- TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) , in collaboration with ...
A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...
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