--SK hynix Inc. announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through ...

SK hynix said that working with TSMC, combining the global leader in the AI memory space with the top global logic factory in the world, will lead to "more innovations" in HBM technology.

TSMC has signed a memorandum of understanding with SK Hynix to collaborate on the production of next-generation HBM (high bandwidth memory) development and next-generation packaging technology. Under ...

Analysts have said that Samsung has been declining, losing out to competitors because of factors other than the US export ...

SK hynix has used a proprietary technology to make base dies up to HBM3E, but plans to adopt TSMC’s advanced logic process for HBM4’s base die so additional functionality can be packed into limited ...

Samsung's challenges bringing HBM3e to market have been a boon for rival SK Hynix, which has become Nvidia's primary supplier ...

The Platinum P51 employs SK hynix's in-house PCIe 5.0 SSD controller. In this instance, the manufacturer has implemented the ...

The two technology leaders discussed the progress and details of their on-going partnership, with TSMC contract manufacturing SK hynix's HBM memory chips, which are the key part to NVIDIA's ...

SK Hynix‘s plan to begin manufacturing its next-generation HBM4 memory chips in 2025 was initially centered around using a 5-nanometer process.However, the company now appears to be taking ...

TSMC expects its Q3 2025 revenue to be between $22.4 billion and $23.2 billion. Samsung and SK hynix typically do not provide revenue guidance for upcoming quarters, so the Chosun Daily cited ...

TSMC has signed a memorandum of understanding with SK Hynix to collaborate on the production of next-generation HBM (high bandwidth memory) development and next-generation packaging technology. Under ...

Under the terms of the agreement, SK Hynix will adopt TSMC’s foundry processes to develop HBM4, the sixth generation of HBM, which is expected to go into production in 2026.