A new technical paper titled “DiffChip: Thermally Aware Chip Placement with Automatic Differentiation” was published by researchers at MIT and IBM. “Chiplets are modular integrated circuits that can ...

In the fast-paced realm of semiconductor technology, optimizing chip design to meet the dual challenges of performance enhancement and cost reduction has emerged as a pivotal focus. A new study ...

Field-Programmable Gate Arrays (FPGAs) remain at the forefront of modern electronic design, owing to their inherent reconfigurability and cost-effectiveness. Recent advances in placement and ...