Young and the Invested on MSN
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Abstract: Voltage source converters (VSCs) based on series-connected power devices can have smaller size compared to modular multilevel converters. Voltage of series-connected SiC MOSFETs can be ...
Abstract: Heterogeneous 3D integration technology is a cost-effective and high-performance alternative to planar integrated circuits (ICs). In this paper, we propose an on-chip power distribution ...
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