An international team that includes ECE's Paolo Pintus, Mario Dumont, Galan Moody, and John Bowers develops a faster, more durable optical platform for in-memory computation From the COE News article ...

Global companies partner to integrate AI into operations. Trump's second term saw $500B Stargate AI venture, intensifying competition with Google, Microsoft, Amazon. OpenAI, SoftBank, Oracle, MGX ...

The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...

There are two ways to make semiconductors more powerful: scaling technology to shrink transistors in nanometer-level sizes to fit more of them onto a chip and introducing innovative packaging ...

Lam Research's Q2-2025 earnings beat expectations, with strong revenue and EPS growth. Read why I remain neutral on LRCX ...

According to a report by , Tongfu Microelectronics is rumored to have commenced trial production of high bandwidth memory ...

Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

Samsung began supplying HBM3E 8-Hi and 12-Hi in Q3 2024, still working on 'optimized version' of HBM3E for Q1 2025, while ...

The operating profit of South Korean tech giant Samsung Electronics sank almost a third in the fourth quarter owing to ...

Despite DeepSeek and Qwen 2.5 disrupting the global tech sector, investors welcomed the impressive Q4 AI revenues from ...

Samsung has reportedly been approved to provide its 8-layer HBM3E memory to NVIDIA, will be used in less-powerful AI GPUs headed to China.

NVIDIA CEO Jensen Huang reportedly doesn't trust Samsung HBM memory and engineers, stating that his company can't trust Samsung HBM products or do ...