End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within ...

How to put the pieces together in a complex design with AI is an unsolved problem.

Using horizontal integration with virtual electronic control units (vECUs), test automation, and continuous integration.

Software-defined products and custom silicon; finFET stress deformation; testing AI data center networks; European ...

How inductive sensing (combined with capacitive sensing in some cases) enables a new level of smart surfaces with touch HMI.

A new technical paper titled “Concealable physical unclonable functions using vertical NAND flash memory” was published by ...

A new technical paper titled “Modeling PFAS in Semiconductor Manufacturing to Quantify Trade-offs in Energy Efficiency and ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures.

The researchers used it to map stray magnetic fields from CoFeB–SiO2 thin films used in high-frequency inductors. They ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at ...