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Taiwan Semiconductor Manufacturing marks another milestone as it breaks ground on third Phoenix factory with Commerce Secretary Lutnick attending.

Planned to be commissioned by the end of this decade, the third fab will produce chips using 2nm or more advanced processes.

TSMC breaks ground for its third Fab 21 module in the U.S., which will produce chips on A16 and N2 process technologies ...

The Taiwan Semiconductor Manufacturing Company has started construction on a third semiconductor fabrication facility in ...

TSMC Arizona broke ground on its third factory in Arizona on Tuesday while getting a visit from a top Trump administration official.

Investing.com-- Taiwan Semiconductor Manufacturing (NYSE: TSM) (TSMC) said on Tuesday it had broken ground on a third chip ...

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) broke ground on its third semiconductor manufacturing fab in Arizona ...

Taiwan Semiconductor Manufacturing Co. (TSMC) has broken ground on the third semiconductor manufacturing facility at its campus in Phoenix, Arizona. Under the Investment Accelerator Program, the third ...

Apple has reaffirmed its commitment to making chips in the United States as Taiwan Semiconductor Manufacturing Company (TSMC) ...